bat 46 small signal schottky diode description general purpose, metal to silicon diode featuring high breakdown voltage low turn-on voltage. november 1994 do 35 (glass) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f forward continuous current* t a =25 c 150 ma i frm repetitive peak forward current* t p 1s d 0.5 350 ma i fsm surge non repetitive forward current* t p = 10ms 750 ma p tot power dissipation* t l =80 c 150 mw t stg t j storage and junction temperature range - 65 to + 150 - 65 to + 125 c c t l maximum temperature for soldering during 10s at 4mm from case 230 c absolute ratings (limiting values) symbol test conditions value unit r th(j-a) junction-ambient* 300 c/w thermal resistance * on infinite heatsink with 4mm lead length 1/4
* pulse test: t p 300 m s d< 2% . symbol test conditions min. typ. max. unit v br t j =25 ci r =10 m a 100 v v f * t j =25 c i f = 0.1ma 0.25 v t j =25 c i f = 10ma 0.45 t j =25 c i f = 250ma 1 i r * t j =25 c v r = 1.5v 0.5 m a t j =60 c 5 t j =25 c v r = 10v 0.8 t j =60 c 7.5 t j =25 c v r = 50v 2 t j =60 c 15 t j =25 c v r = 75v 5 t j =60 c 20 static characteristics electrical characteristics symbol test conditions min. typ. max. unit ct j =25 cv r = 0v f = 1mhz 10 pf t j =25 cv r =1v 6 dynamic characteristics 2/4 figure 1. forward current versus forward voltage at different temperatures (typical values). figure 2. forward current versus forward voltage (typical values). bat 46
figure 3. reverse current versus junction temperature (typical values). figure 4. reverse current versus continuous reverse voltage. figure 5. capacitance c versus reverse applied voltage v r (typical values). 3/4 bat 46
cooling method: by convection and conduction marking: ring at cathode end. weight: 0.05g package mechanical data 4/4 note 2 ba b c note 1 note 1 dd o / o / o / e e do 35 glass ref. dimensions notes millimeters inches min. max. min. max. a 3.050 4.500 0.120 0.117 1 - the lead diameter ? d is not controlled over zone e 2 - the minimum axial lengh within which the device may be placed with its leads bent at right angles is 0.59o(15 mm) b 12.7 0.500 ? c 1.530 2.000 0.060 0.079 ? d 0.458 0.558 0.018 0.022 e 1.27 0.050 information furnished is believed to be accurate and reliable. however, sgs-thomson microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of sgs-thomson microelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. sgs-thomson microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of sgs-thomson microelectronics. ? 1994 sgs-thomson microelectronics - printed in italy - all rights reserved. sgs-thomson microelectronics group of companies australia - brazil - france - germany - hong kong - italy - japan - korea - malaysia - malta - morocco - the netherlands singapore - spain - sweden - switzerland - taiwan - united kingdom - u.s.a. bat 46
|